Semiconductor encloses a mould to move toward automation

  • Time:
  • Click:96
  • source:MARSTEN CNC Machining
The technology develops semiconductor to enclose a mould to move toward automation semiconductor to enclose mould course of study is to the requirement of the mould: It is mould of requirement finish machining, electronic product is ceaseless and at present compositive change, miniaturization, product direction high end, size is smaller and smaller also, enclose body thinner and thinner, this is taller and taller to enclosing a requirement, very tall to mould precision requirement. Model seals modular craft is one of all in all technology measures in production of the working procedure after semiconductor device, general application one-cylinder encloses a technology, its enclose an object to include DIP, SOP, QFP, SOT, SOD, TR kind schism parts of an apparatus and piece the series product such as circuit of type Tantalum capacitance, inductance, bridge-type. Enclose a technology to developing ceaselessly nowadays. Chip measure is narrow, chip area is compared with what enclose an area more and more adjacent at 1, i/O counts the grow in quantity, span that cite a base to reduce. The development that encloses a technology cannot leave advanced electron to be versed in the mould equips, much inject head encloses a mould (rush MGP) , automatically cut shape to enclosed the high-tech new product such as the system system, automatically to get used to this one demand, 3 beautiful also roll out these products in succession. Much inject head encloses a mould (MGP) is one-cylinder mould technology is outspread, it is to enclose mould mainstream product nowadays. Its use head of much material canister, much inject to enclose a form, the advantage depends on but balanced flow path, realize close quarters fill, colophony utilization rate is high, enclose craft stability, it is good that goods encloses quality. It applies to the much platoon such as SSOP, TSSOP, LQFP, bar to be apart from, the product of miniature semiconductor device such as high density integrated circuit and SOT, SOD is enclosed. Rush automatically cut shape the system is the automation equipment that the working procedure after integrated circuit and semiconductor device shapes. High speed, muti_function, versatility is strong it is direction of this system development, the product that can satisfy carrier of frame of of all kinds down-lead shapes. Semiconductor will enclose a mould to develop way henceforth is to more high accuracy, more high-speed encloses a mould---Enclose mould development automatically. Automatic model seals a system is equipment of the high accuracy that the working procedure after integrated circuit encloses, tall automation. Many model are installed to seal working unit in the system, model of MGP of modular box type is installed in every unit, many unit undertake enclosing by work out order, overall on collect piece, on makings, enclose, next makings, clear pattern, except glue, close makings at an organic whole. Development of this technology abroad is rapidder, already appeared to stick film to enclothe enclose, the model that nod glue is sealed wait for a technology, can satisfy what of all kinds high density, tall down-lead counts a product to enclose. Develop at full speed as microelectronics technology, model of the working procedure after semiconductor is sealed shape equipment application technology rises ceaselessly, automation exercise already became inevitable trend. 3 beautiful regard home as industry of the first mould appear on the market company, will stare at world advanced technique closely, accelerate electronic mould homebred change a course. CNC Milling